| 摘要 |
Microelectronic imaging units and methods for manufacturing the microelectronic imaging units. In one embodiment, an imaging unit includes a support member, an imaging die attached to the support member, and a driving member attached to the imaging die and the support member. The imaging die includes an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The driving member is configured to selectively move the imaging die relative to the support member. For example, the image sensor can define a focal plane, and the driving member can move the imaging die along an axis in the focal plane. |
