| 摘要 |
PROBLEM TO BE SOLVED: To prepare a pressure-sensitive sheet for manufacturing semiconductor devices which can prevent wire bonding failure, mold flash and adhesive transfer, and hence can prevent semiconductor devices from becoming defectives, when it is used for the manufacture of the semiconductor devices including QFN, or the like. SOLUTION: This pressure-sensitive adhesive sheet for manufacturing semiconductor devices has a pressure-sensitive adhesive layer on one side of a heat- resistant base-material and is laminated releasably on a lead frame, wherein the pressure-sensitive adhesive layer is formed by using a silicone-based pressure- sensitive adhesive containing a polyorganosiloxane having an average molecular weight of 10,000-1,500,000 and has a dynamic modulus at 150-200 deg.C of 1.0×10<4> Pa or more. As the polyorganosiloxane contained in silicone-based pressure- sensitive adhesive, a polydimethylsiloxane, a polyalkylalkenylsiloxane or a polymethylphenylsiloxane is preferable. |
