| 摘要 |
<p>A handler arm pad of semiconductor manufacturing equipment is provided to prevent a wafer from being dropped by absorbing completely the pad to a finger for preventing an adhesive portion of the pad from deformed by heat by eliminating micro air particles through a exhaust hole. A pickup arm(100) of a wafer transfer robot consists of a finger(112) for mounting a wafer to load and unload the wafer, and a body(110) which is formed into one body with the finger and connected to a main body of the robot. A plurality of holes(114) are formed at the body so as to fix the pickup arm onto the transfer robot by using a mechanical method like a screw.</p> |
