| 摘要 |
Disclosed is a positive photosensitive resin composition having good heat resistance and transparency. The positive photosensitive resin composition contains a resin component (A1) having a constitutional unit (a1') which is obtained by substituting at least some of hydrogen atoms in a phenolic hydroxyl group in the constitutional unit represented by the general formula (a1) below with a naphthoquinone-1,2-diazide-5-(and/or-4-)sulfonyl group. (In the above general formula, R0 represents a hydrogen atom or a methyl group; R1 represents a single bond or an alkylene group having 1-5 carbon atoms; R2 represents an alkyl group having 1-5 carbon atoms; and a represents an integer of 1-5, b represents 0 or an integer of 1-4, and a + b is not more than 5. When two or more R2's exist, these R2 's are the same as or different from each other.)
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