| 摘要 |
A power semiconductor module has a substrate ( 1 ) on which several pressure elements ( 16, 17, 18, 19 ) perform a mechanical pressure (F) at different areas ( 10, 11, 12, 13 ) thereof in a direction of a cooling element in order to press the underside ( 1 b) of the substrate and reject heat towards said cooling element. In order to apply an essentially even and non-influenced by the component tolerances force to each area of the substrate, the pressure elements perform an elastic action on the substrate areas. The pressure elements ( 16, 17, 18, 19 ) are formed on the first part ( 21 ) of a housing which is movable with respect to the second part ( 22 ) thereof provided with spacing elements ( 30, 31, 32, 33 ) defining a supporting surface ( 34 ) in such a way that the first part ( 21 ) of the housing is fixed at a certain distance from the substrate ( 1 ).
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