Substrate for mounting flip chip and the manufacturing method thereof,申请号KR20060028330-传众专利搜索

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发明名称	Substrate for mounting flip chip and the manufacturing method thereof
摘要
申请公布号	KR100773331(B1)	申请公布日期	2007.11.05
申请号	KR20060028330	申请日期	2006.03.29
申请人		发明人
分类号	H01L23/12	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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