| 摘要 |
A semiconductor package is provided to improve brightness and optimize a light emitting efficiency by forming a fluorescent layer and a fluorescent sheet on a layer, which is formed by using a diffuser. A semiconductor package includes an LED(Light Emitting Device) chip(10) and a substrate. The substrate includes a cavity and a reflective surface(18). The LED chip is mounted on the cavity. The reflective surface is formed along an inner side surface of the cavity. A diffuser layer(30) and a fluorescent layer(32) are formed in the cavity. The diffuser layer at least contains a diffuser(30a). A fluorescent sheet is formed on the diffuser layer and the fluorescent layer. The LED chip is mounted, such that the LED chip is buried in the diffuser layer. |
