发明名称 Etching apparatus and etching method for substrate bevel
摘要 In the bevel etching apparatus relating to the present invention, a substrate is inserted between electrically connected electrodes. A high-frequency power source is connected to the electrodes, and ground potential is applied to a support unit that supports the substrate. Gas (atmosphere) is supplied to the gap between the electrodes and the application of the high-frequency electric power to the electrodes causes the generation of atmospheric-pressure glow discharge between the electrode and the substrate. Bevel etching is performed by rotating the substrate along the circumferential direction in this condition. According to this construction, the bevel etching can be simultaneously performed to the front surface, the rear surface and the side of the substrate without causing any configuration change in the substrate.
申请公布号 US2007251919(A1) 申请公布日期 2007.11.01
申请号 US20070790738 申请日期 2007.04.27
申请人 IMAI SHIN-ICHI 发明人 IMAI SHIN-ICHI
分类号 C03C25/68;G01L21/30 主分类号 C03C25/68
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