发明名称 |
APPARATUS AND METHOD FOR USE IN MOUNTING ELECTRONIC ELEMENTS |
摘要 |
Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part toward a perimeter of the casing, and the second electrode can extend away from the chip carrier part and projects outside of the casing. In extending away from the chip carrier part the first electrode divides into a plurality of leads separated by an aperture that join into a single first joined lead portion with a first width before projecting outside of the casing and maintains the first width outside of the casing. The second electrode can attain a second width prior to projecting outside of the casing and maintains the second width outside the casing. |
申请公布号 |
WO2007122516(A2) |
申请公布日期 |
2007.11.01 |
申请号 |
WO2007IB02411 |
申请日期 |
2007.04.25 |
申请人 |
COTCO LUMINANT DEVICE LTD.;XIE, JIAN HUI;CHENG, SIU CHEONG |
发明人 |
XIE, JIAN HUI;CHENG, SIU CHEONG |
分类号 |
H01L23/50;H05K13/04 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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