| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for multilayer wiring board which allows the inner wall roughness of a hole to be small, even when a drill-processing is performed for two or more substrates in piles, and multilayer wiring boards excellent in quality to be efficiently manufactured, when the drill-processing in a manufacture process for multilayer wiring board is performed. SOLUTION: The manufacturing method for multilayer wiring board includes a step of performing the drill-processing for two or more substrates in piles. This manufacturing method for multilayer wiring board makes the drill-processing perform using a drill of which the margin length lm is 0.60 mm or less. COPYRIGHT: (C)2008,JPO&INPIT |
