发明名称 STENCIL MASK
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a stencil mask having through-holes for forming a variety of irradiation regions in which a desired region on the surface of a semiconductor substrate is irradiated with ionized atoms having passed through the through-hole with high coincidence. <P>SOLUTION: The stencil mask 10 has a backside layer 50 on the side where a semiconductor substrate is arranged, a surface layer 20 on the incident side of ionized atoms, and an intermediate layer 30 provided between the backside layer 50 and the surface layer 20. Third through-holes 52 and 56 having a profile corresponding to a predetermined region are formed in the backside layer 50. Second through-holes 32 and 36 communicating with the third through-holes 52 and 56 are formed in the intermediate layer 30. In a range of the surface layer 20 corresponding to at least one round second through-holes 32, a plurality of first through-holes 22 communicating with that round second through-holes 32 are formed while being dispersed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007287972(A) 申请公布日期 2007.11.01
申请号 JP20060114381 申请日期 2006.04.18
申请人 TOYOTA MOTOR CORP;ULVAC JAPAN LTD 发明人 NISHIWAKI TAKESHI;SAITO HIROKAZU;NISHIBASHI TSUTOMU;TONARI KAZUHIKO
分类号 H01L21/027;G03F1/20;H01L21/266 主分类号 H01L21/027
代理机构 代理人
主权项
地址