| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a wafer in which such an inconvenience as the adhesive of a protective tape fuses and solidifies in a device region does not occur. SOLUTION: A device region 4 in which a plurality of semiconductor chips 3 are formed and an outer circumference surplus region 5 surrounding the device region 4 are formed on the surface of a wafer 1 and the backside of the wafer is ground. The backside region corresponding to the device region 4 is ground concavely and a ringlike reinforcing portion is formed in the backside region corresponding to the outer circumference surplus region. The processing method of a wafer 1 comprises a step for sticking a protective tape 6 having adhesive 6a only in the region corresponding to the outer circumference surplus region 5, a step for grinding the backside region corresponding to the device region 4 of the wafer 1, an additional step for processing the wafer 1 to raise the temperature thereof, a step for removing the reinforcing portion 1b, and a step for sticking the wafer 1 from which the reinforcing portion 1b is removed to a dicing tape and stripping the protective tape. COPYRIGHT: (C)2008,JPO&INPIT
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