发明名称 A SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS WITH A PASSIVE SUBSTRATE GRIPPER
摘要 According to one aspect of the present invention, a passive substrate gripper, including first and second segments, is provided. The second segment may be connected to the first segment, and the first and second segments may jointly form a substrate support. The substrate support may be shaped to support a substrate in first position within the substrate support when the substrate support is in a first angular orientation. The substrate may be removable from substrate support in a first direction when in the first position. The substrate may move into a second position when the substrate support is moved into a second angular orientation. The substrate may not be removable in the first direction when in the second position within the substrate support. The passive substrate gripper may also include a support ledge extending from opposing inner surfaces of the first and second segments, on which the substrate is supported.
申请公布号 WO2007001663(A3) 申请公布日期 2007.11.01
申请号 WO2006US18703 申请日期 2006.05.15
申请人 APPLIED MATERIALS, INC.;WADENSWEILER, RALPH, M.;ENDO, RICK, R.;KO, ALEXANDER, S. 发明人 WADENSWEILER, RALPH, M.;ENDO, RICK, R.;KO, ALEXANDER, S.
分类号 B65H1/00 主分类号 B65H1/00
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