发明名称 BLASTING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a blasting method having a high selection ratio, high processing rate of a layer to be processed, and small amount of shift. SOLUTION: In the blasting method, a substrate or a laminate film to be laminated on the substrate is made to the layer to be processed, a resist layer is laminated on the processed surface so that the processed surface of the layer to be processed is partially exposed, and the layer to be processed is selectively processed by causing abrasive grains to collide with the side of the processed surface partially exposed by an air jet flow. The blasting method is characterized in that the abrasive grains are spherical or ellipsoidal. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007283438(A) 申请公布日期 2007.11.01
申请号 JP20060113698 申请日期 2006.04.17
申请人 NTT ELECTORNICS CORP 发明人 MATSUNAGA KAZUO;SHUDO KEIZO;OMORI YASUJI
分类号 B24C1/04;B24C11/00 主分类号 B24C1/04
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