| 摘要 |
PROBLEM TO BE SOLVED: To prevent an electric defect caused by getting around of ink from the back face of an electric wiring substrate and corrosion of wiring thereby. SOLUTION: By providing a recessed part 105e on the back face of the electric wiring substrate by a solder resist 105d for protecting a wiring part of the electric wiring substrate or a wiring being not connected, and covering surely an adhesive for sticking the electric wiring substrate to the recessed part, the wiring part of the electric wiring substrate is protected from the ink only with the adhesive. COPYRIGHT: (C)2008,JPO&INPIT
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