| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated wafer which is capable of completely removing an island-shaped active layer left on a terrace with less abrasive wear amount using a prescribed bonded abrasive polishing cloth. SOLUTION: The wafer manufacturing method comprises a polishing process of polishing the prescribed peripheral part of a wafer 6 supplying a polishing solution to the bonded abrasive polishing cloth 2 to make a prescribed surface smooth. The bonded abrasive polishing cloth 2 is composed of a soft segment with a multifunctional isocyanate and a hard segment with a multifunctional polyol, and provided with an urethane binding material whose expansion rate is as high as 1.1 to 4 and silica that is 0.2 to 10μm in average grain diameter and has hydroxyl groups. The molecular weight ratio of the hard segment to the urethane binding material is 40 to 55%, the volume ratio of the silica to the whole bonded abrasive polishing cloth 2 is 20 to 60%, and the bonded abrasive grain polishing cloth 2 is characterized in that its Shore D hardness is 40 to 80. COPYRIGHT: (C)2008,JPO&INPIT
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