发明名称 Transparent substrate heat dissipater
摘要 The present invention discloses a heat dissipater for a chamber comprising a substantially transparent substrate, a first substantially transparent conductive pattern formed over the substrate. At least one Peltier device is formed on the first substantially transparent conductive pattern. A second substantially transparent conductive pattern is then formed on the Peltier device, wherein electricity is applied to the Peltier device, current drives a heat transfer from inside of the chamber to outside.
申请公布号 US2007253167(A1) 申请公布日期 2007.11.01
申请号 US20070819124 申请日期 2007.06.25
申请人 CHIANG KUO C 发明人 CHIANG KUO C.
分类号 H05K7/20;F28D15/00 主分类号 H05K7/20
代理机构 代理人
主权项
地址