SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To make a test efficient since a rate of test cost occupied in product cost becomes high due to increase of a test circuit scale and prolonging time of the test since a scale of a semiconductor integrated circuit becomes large in recent years and there is a process for occupying an inspection device in a wafer state for long time such as an acceleration test and regular inspection in a wafer level.

SOLUTION: The semiconductor integrated circuit is provided with wiring connecting chips 112 on a wafer 111, a structure which electrically interrupts wiring and a structure which can conduct a test on all the chips at once. To put it concretely, a common region only for test circuit for conducting the test on a plurality of chips is formed on the wafer, and test circuits are removed from the respective chips 112. A terminal of the chip 112 and a terminal of the test circuit 511 are connected by wiring of a device on the wafer or outside the wafer. Thus, the regular inspection is performed during burn in.

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