| 发明名称 |
SECTIONAL MOLDING SYSTEM |
| 摘要 |
<p>The invention provides a molding system for encapsulating a piece of substrate having a plurality of molding sections. The system comprises a molding device operative to separately encapsulate each molding section with a molding compound and indexing means operative to position said molding sections of the substrate relative to the molding device for encapsulation.</p> |
| 申请公布号 |
SG135988(A1) |
申请公布日期 |
2007.10.29 |
| 申请号 |
SG20060016331 |
申请日期 |
2004.05.26 |
| 申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
CHUEN HO SHU;JIE LIU;YAP ONG SEE |
| 分类号 |
H01L21/00;H01L21/56;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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