| 摘要 |
<p>A negative liquid photoresist resin composition is provided to improve the adhesive strength between a photoresist and a copper plate, thereby enhancing resolution. A negative liquid photoresist resin composition comprises a base polymer; a photopolymerization initiator; a photopolymerizable monomer; a solvent; other additives; and optionally 0.1-2 wt% of a (meth)acryloxy-based silane coupling agent represented by the formula 1, wherein R1 is a C1-C3 alkoxy group; R2 is a C1-C3 alkyl group, or a C1-C3 alkoxy group; and R3 is H2C=CH or H2C=CCH3. Preferably the base polymer is an acrylate polymer dissolved in 1-methoxy-2-propanol solvent and has a glass transition temperature of 100-150 deg.C, an acid value of 40-150 mg KOH/g and a weight average molecular weight of 20,000-60,000.</p> |
