| 摘要 |
<p>A photosensitive resin composition is provided to improve the resistance against a developer, thereby enhancing session adhesive strength and resolution and to improve chemical resistance such as gold plating resistance. A photosensitive resin composition comprises a photopolymerization initiator; a photopolymerizable oligomer which comprises a compound represented by the formula 1; a binder polymer; a solvent; and other additives, wherein R1 and R2 are H, a halogen atom, a C1-C5 alkyl group, or a C1-C5 alkyl oxide group; m and n are a number of 0-50; and m+n is a number of 1-100. Preferably the content of the compound of the formula 1 is 0.1-30 wt%.</p> |
