| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor sensor device having a structure capable of preventing a sticking of a sensor structure, and to provide its manufacturing method. <P>SOLUTION: A peripheral position 2b of a concave part 2a of a protective cap 2 is tapered. When a force is added to the cap 2 to push out the adhesive agent 3, the cant of the tapered periphery 2b pushes out the agent 3 not inward but outward the concave part 2a. Consequently, this pusshes the agent 3 out of the concave part 2a to prevent an immersion of it to the sensor structure 1a, which can prevent the sticking of the sensor structure 1a. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
