| 摘要 |
PROBLEM TO BE SOLVED: To provide destructive test equipment suitable for bonding a strength evaluation of a joint between wiring board and spherical solder used for mounting of a semiconductor chip. SOLUTION: This is the destructive test equipment for evaluating a bonding strength in joint of a spherical solder bonded on connecting terminal of the wiring board, equipped with fulcrum for supporting test sample, shear tool 50 which collides with a solder ball 40 melt-connected to ball pad 20 in the test sample fastened onto the above fulcrum to apply a horizontal force to joint interface, and mechanism for allowing the above solder ball 40 to be collided with the above shear tool 50 at the travel speed of 5 cm or more per minute. The portion of the above shear tool 50 to be collided with the above solder ball 40 has a plane perpendicular to the above joint interface. COPYRIGHT: (C)2008,JPO&INPIT
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