发明名称 LED PACKAGE HAVING ANODIZED INSULATION LAYERS, AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED package having a substrate of an LED device made of aluminum material to improve a heat-dissipation effect of the LED device so that a lifetime for use and a light-emission efficiency of the LED package can be greatly enhanced. <P>SOLUTION: There are provided the LED package having anodized insulation layers includes a substrate made of aluminum material and provided with a reflection region formed therein; a light source mounted on the substrate and electrically connected to electrode patterns; anodized insulation layers formed between the electrode patterns and the substrate; and a lens section arranged to cover the light source of the substrate, and its manufacturing method. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007281468(A) 申请公布日期 2007.10.25
申请号 JP20070097039 申请日期 2007.04.03
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE YOUNG KI;CHOI SEOG MOON;SHIN SANG HYUN
分类号 H01L33/58;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/58
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