发明名称 |
LED PACKAGE HAVING ANODIZED INSULATION LAYERS, AND ITS MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package having a substrate of an LED device made of aluminum material to improve a heat-dissipation effect of the LED device so that a lifetime for use and a light-emission efficiency of the LED package can be greatly enhanced. <P>SOLUTION: There are provided the LED package having anodized insulation layers includes a substrate made of aluminum material and provided with a reflection region formed therein; a light source mounted on the substrate and electrically connected to electrode patterns; anodized insulation layers formed between the electrode patterns and the substrate; and a lens section arranged to cover the light source of the substrate, and its manufacturing method. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2007281468(A) |
申请公布日期 |
2007.10.25 |
申请号 |
JP20070097039 |
申请日期 |
2007.04.03 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
LEE YOUNG KI;CHOI SEOG MOON;SHIN SANG HYUN |
分类号 |
H01L33/58;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L33/58 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|