| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of removing an electricity at low cost. SOLUTION: In a cleaning process of a dicing step, for instance, a semiconductor wafer 200 with a tape electrostatically charged by the cleaning is lifted from a cleaning stage 230 to the specific height h1 by a transferring arm 210, and in this state, the electricity on the surface side of the semiconductor wafer W is removed by an electricity removing means 70. The height h1 is as high as possible to the extent that the semiconductor wafer W is not damaged by an electrostatic discharge, for instance, the height is about 10 mm. After the completion of the removal of the electricity, the wafer 200 is further lifted to the height where the wafer can be adequately transferred, and transferred to the next step. COPYRIGHT: (C)2008,JPO&INPIT |
