发明名称 MULTI-CHIP PACKAGE
摘要 A multi-chip package is provided to reduce the number of multi-chip packages capable of performing test at the same times with one logic tester by testing the whole memory without using all of address pins. A plurality of memory devices(60,70,80) operates independently. A DA mode decoder decodes an address and a command inputted to a first memory device from a logic tester in a DA(Direct Access) mode to a memory device discriminated among the plurality of memory devices. The DA mode decoder further receives an M bit address signal to discriminate each memory device through an address pin of a second memory device.
申请公布号 KR20070103840(A) 申请公布日期 2007.10.25
申请号 KR20060035673 申请日期 2006.04.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, JUNG HWAN
分类号 G11C29/14 主分类号 G11C29/14
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