发明名称 SURFACE MOUNT HEADER ASSEMBLY HAVING A PLANAR ALIGNMENT SURFACE
摘要 A header assembly includes an insulative housing (300) having a plurality of walls defining an interior cavity (308) extending along a mating axis (311), and a plurality of contacts (350, 370) within the cavity and extending through one of the walls (306) to an exterior of the housing for surface mounting to a circuit board (303). The insulative housing includes at least one alignment rib (330) extending on an exterior surface thereof in a direction substantially perpendicular to the mating axis. The contacts abut said alignment rib and are preloaded against said alignment rib as said contacts are installed into said housing, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.
申请公布号 KR20070104427(A) 申请公布日期 2007.10.25
申请号 KR20077019242 申请日期 2007.08.23
申请人 TYCO ELECTRONICS CORPORATION 发明人 MYER JOHN MARK;CAMPBELL CRAIG MAURICE;MALSTROM CHARLES RANDALL;FRY DANIEL WILLIAMS JR.;MOLL HURLEY CHESTER
分类号 H01R12/71;H01R43/02 主分类号 H01R12/71
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