| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which migration resistance can be enhanced and adhesion and bendability can be improved by rationalizing the material of a coated member. SOLUTION: A wiring member 3 is formed of an Ag coating on an insulating substrate 2, and the wiring member 3 and the insulating substrate 2 are covered with acryl resin and a coating member 4 having hexamethylene diisocyanate (HDI) and dipenylmethane diisocyanate (MDI) as a curing agent. Consequently, migration resistance can be enhanced even if a wiring member 3 of Ag coating is employed. Furthermore, bendability of a flexible printed board 1, adhesion between the insulating substrate 2 and the coating member 4 and between the coating member 4 and the wiring member 3, and non-adhesiveness of the surface of the coating member 4 can be enhanced, respectively. COPYRIGHT: (C)2008,JPO&INPIT
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