PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING SAME

摘要

Disclosed is a photosensitive resin composition containing (A) a base polymer having a repeating unit represented by the general formula (1) below, (B) an acrylic polymer having a photopolymerizable unsaturated group, (C) an inorganic filler, (D) a photopolymerizable monomer and (E) a photoreaction initiator. Also disclosed is a photosensitive element comprising a photosensitive resin composition layer which is formed by using such a photosensitive resin composition. (1) [In the formula (1), R<SUP>1</SUP> represents a divalent organic group which is a diglycidyl ether type epoxy compound residue; R<SUP>2</SUP> represents a divalent organic group which is a dibasic acid residue; and R<SUP>3</SUP> and R<SUP>4</SUP> independently represent a hydrogen atom or a group represented by the following general formula (2): (2) (wherein R<SUP>5</SUP> represents an acid anhydride residue).]