| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electroconductive adhesive used when bonding a semiconductor element such as an IC and a chip part such as a chip resistor a chip LED (light-emitting diode) to a lead frame, a heat dissipation board, etc., having stress relaxing properties to an FPC board (flexible printed circuit board) and affording a cured product having excellent electroconductivity, adhesiveness, heat and moisture resistances, flexibility and operation efficiency. <P>SOLUTION: The electroconductive adhesive comprises an electroconductive filler (A), a resin binder (B) and an organic solvent (C). In the electroconductive adhesive, the content of the electroconductive filler (A) is 70-90 wt.% based on the whole composition. The resin binder (B) consists essentially of an epoxy resin (b1) which is a liquid at room temperature and further comprises an epoxy resin (b2) which is a solid at room temperature and has 500-10,000 average molecular weight. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
