发明名称 |
PREPREG, METAL FOIL CLAD LAMINATED PLATE AND PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board that is halogen-free and gives a good hole shape in the processing by a carbon dioxide laser, and provide a prepreg and a metal foil clad laminated plate used as the materials therefor. SOLUTION: The prepreg is formed by impregnating or coating a substrate with a thermosetting resin composition which contains boehmite as an inorganic filler and does not contain a metal hydroxide other than boehmite and a halogenated compound, and drying it. COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2007277334(A) |
申请公布日期 |
2007.10.25 |
申请号 |
JP20060103051 |
申请日期 |
2006.04.04 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
KOIZUMI KAORU |
分类号 |
C08J5/24;B32B15/092;C08K3/22;C08L63/00;C08L79/04;C08L101/00;H05K1/03 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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