发明名称 PREPREG, METAL FOIL CLAD LAMINATED PLATE AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board that is halogen-free and gives a good hole shape in the processing by a carbon dioxide laser, and provide a prepreg and a metal foil clad laminated plate used as the materials therefor. SOLUTION: The prepreg is formed by impregnating or coating a substrate with a thermosetting resin composition which contains boehmite as an inorganic filler and does not contain a metal hydroxide other than boehmite and a halogenated compound, and drying it. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007277334(A) 申请公布日期 2007.10.25
申请号 JP20060103051 申请日期 2006.04.04
申请人 MITSUBISHI GAS CHEM CO INC 发明人 KOIZUMI KAORU
分类号 C08J5/24;B32B15/092;C08K3/22;C08L63/00;C08L79/04;C08L101/00;H05K1/03 主分类号 C08J5/24
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