| 摘要 |
PROBLEM TO BE SOLVED: To provide a hot-dip plated wire cooling device capable of preventing introduction of a wire from a lower side in the vertical direction into a still water essential for ensuring the hot-dip plating deposition per unit area, from flow-out, leakage or dripping of cooling water from an opening part in the vertical direction while preventing defects on a hot-dip plated surface when cooling the hot-dip plated wire. SOLUTION: The hot-dip plated wire cooling device comprises a cooling water holding tank having an opening part in a bottom side, a cylindrical rotating body having a downwardly projecting rotation-symmetric plane which is rotated at the angular velocity of≥5 turns/second while holding a space of 1 mm to 4 mm from a hot-dip plated wire at the bottom opening part, and a collection mechanism for collecting cooling water along an outer circumference of a lower edge of the rotating body. COPYRIGHT: (C)2008,JPO&INPIT
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