| 摘要 |
PROBLEM TO BE SOLVED: To achieve a multilayer printed-wiring board used for the packaging substrate such as a semiconductor package and a compact module component that need to satisfy a reliability standard that is higher than that of a fine wiring pattern, semiconductor packaging, or the like. SOLUTION: The method of manufacturing the multilayer printed-wiring board comprises: a process for forming a via hole 12 in an electrically insulating base 11 made of an insulating material, a process for forming an interlayer connection material 13 having a thermal coefficient of expansion in a thickness direction being smaller than that of the insulating material in the via hole 12, and a process for forming interlayer connection at temperature that is higher than the operating environmental temperature in the multilayer printed-wiring board. COPYRIGHT: (C)2008,JPO&INPIT |
