Ball Grid array package structure

摘要

A ball grid array structure includes a substrate, wherein a plurality of electric contacts are arranged on its lower surface; a chip arranged on the upper surface of the substrate and electrically connecting with those electric-connecting points; at least a through hole on the substrate and arranged around the edge of the chip; a molding compound covering the chip and filling the through hole to form a window-type bump on the lower surface of the substrate; and a plurality of conductive balls arranged on those electric-connecting points on the substrate. The present invention utilizes the window-type bump to enhance the structure strength of the substrate to effectively decrease the warpage of package in the curing process and to provide a support to prevent the crack of the package from the external force.