| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means to adhere a semiconductor construct called CSP on a base plate via an adhesive layer so that it may not likely to be inclined. <P>SOLUTION: In each of a plurality of semiconductor construct arrangement regions 31 on top face of the base plate 1, a liquid adhesive 33 is applied in a distributed manner at a plurality of places using a jet type dispenser. Then, using a die bonder, semiconductor constructs 2 are arranged being away from each other on the liquid adhesive 33 applied in the semiconductor construct arrangement regions 31 on top face of the base plate 1, with one semiconductor construct 2 on each semiconductor construct arrangement region 31. Under heat and pressure, the bottom faces of silicon substrates 4 of the semiconductor constructs 2 are pushed against the liquid adhesive 33 to half-cure the liquid adhesive 33. In this case, the swelling-out of the liquid adhesive 33 applied in a distributed manner at a plurality of places in each semiconductor construct arrangement region 31 can be made relatively small and can be uniformed and thereby the semiconductor constructs 2 are not like to be inclined. <P>COPYRIGHT: (C)2008,JPO&INPIT |
