| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesiveness of a conductive layer for a base layer. SOLUTION: A metal wiring forming method has a step of applying a first liquid containing a base layer forming material on a substrate P, a step of thermally treating the applied first liquid to form a base layer F1, a step of applying a second liquid containing metal fine particles on the base layer F1, and a step of thermally treating the applied second liquid to form a conductive layer F2. The first liquid is thermally treated in a condition that the base layer F1 becomes an uncured state, and then, the second liquid is applied. COPYRIGHT: (C)2008,JPO&INPIT |
