| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a built-up multilayer wiring board having high connection reliability by forming a plating layer having a sufficient film thickness and sufficient adhesion on a resin inner wall surface. SOLUTION: A manufacturing method for the built-up multilayer wiring board includes a laser process step of subjecting a multilayer board 7, which has a metal inner layer 2, a resin layer 5 formed on the metal inner layer 2, and a metal surface layer 6 formed on the resin layer 5, to a laser process to form a hole (via-hole 8) on the metal surface layer 6 and the resin layer 5, an ozonic water treatment step of treating the resin inner wall surface 5a in the hole (via hole 8) with ozonic water, and a soldering step of forming soldering layers (first soldering layer 9 and a second soldering layer 10) at least on the resin inner wall surface 5a through a soldering process. COPYRIGHT: (C)2008,JPO&INPIT |
