| 摘要 |
This present invention relates to a contact ( 100 ) for electronic devices ( 1 ). More specifically, a contact ( 100 ) for electronic devices ( 1 ) has an upper contact pin ( 110 ) which includes a contact part ( 111 ) having a predetermined shape and contacting a lead of an object to be tested, that is, an integrated circuit (IC) ( 1 ), two support protrusions ( 112, 113 ) and a body ( 118 ); a lower contact pin ( 130 ) coupled to the upper contact pin ( 110 ) to be orthogonal to the upper contact pin ( 110 ); and a spring ( 190 ) fitted over a predetermined area between the upper and lower contact pins ( 110, 130 ). |
