发明名称 Pressure-punch device for film welding
摘要 In a pressure stamp device for the sealing of films with a slidable stamp element with a stamping surface for applying pressure to a first foil to bond it to a supported second foil, a substantially homogeneous internal temperature distribution is reached by contributing the stamping element with multiple layers so that it includes basically three layers with a heated central layer of a first material with a thermal conductivity and two peripheral layers of a second material flanking it, the surface being formed by one of the peripheral layers to constitute the stamping surface.
申请公布号 US7285750(B2) 申请公布日期 2007.10.23
申请号 US20050538247 申请日期 2005.06.07
申请人 BENTELE JOSEF 发明人 BENTELE JOSEF
分类号 H05B3/30;B29C65/02;B29C65/18;H05B3/28;H05B3/56 主分类号 H05B3/30
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