RESIN COMPOSITION FOR ENCAPSULATING FILLER, METHOD OF FLIP CHIP MOUNTING WITH THE SAME, AND PRODUCT OF FLIP CHIP MOUNTING

摘要

A resin composition for encapsulating fillers which, in a continuous voltage application test under high-temperature high-humidity conditions, does not induce electrode corrosion in the wiring circuit board and which has satisfactory stability at ordinary temperature. The resin composition contains a polyamic acid and/or a polyimide. The polyamic acid preferably is one represented by the following general formula (1): (1) wherein Ar¹ represents a tetravalent organic group; Ar² represents a divalent organic group; and l is an integer of 1 or larger. The polyimide preferably is one represented by the following general formula (2): (2) wherein Ar³ represents a tetravalent organic group; Ar⁴ represents a divalent organic group; and m is an integer of 1 or larger.