<p>Disclosed is an electronic device case comprising a metal base portion (101), a resin portion (402) fixed to the base portion (101), and a printed board (104) in contact with the resin portion (402). Fixing between the base portion (101) and the resin portion (402) is achieved by nanomolding technique, and the resin portion (402) has insulating properties.</p>
申请公布号
WO2007116801(A1)
申请公布日期
2007.10.18
申请号
WO2007JP56819
申请日期
2007.03.29
申请人
MITSUBISHI ELECTRIC CORPORATION;SATONE, TOSHIKAZU;IIJIMA, MIKIO;NAKAJIMA, HAJIME;OKAMURO, TAKASHI;OHMURA, YOHICHI
