| 摘要 |
A method for manufacturing a field emission substrate is disclosed. The method includes the following steps: providing a substrate having a conductive layer; forming a hydrophobic layer on the conduction layer; patterning the hydrophobic layer; and removing the hydrophobic layer from the surface of the conductive layer so that the formed layer of electron-emitting materials can contact the surface of the conductive layer. The patterned hydrophobic layer can include plural bumps, and the pitches between the neighboring bumps are in a range of 1 mum to 500 mum. By way of the steps illustrated above, the emitting layer on the substrate can be made easily and arranged accurately. Hence, the electrons can be emitted homogeneously.
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