发明名称 SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which a silicon oxide film exhibiting excellent embedding properties and film properties is formed onto recesses having high aspect ratio. <P>SOLUTION: The semiconductor device includes: an underlying layer region having recesses formed on a main surface side of the semiconductor device, and the silicon oxide film containing chlorine embedded inside the whole recesses of the underlying layer. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007273994(A) 申请公布日期 2007.10.18
申请号 JP20070102113 申请日期 2007.04.09
申请人 TOSHIBA CORP 发明人 TANAKA MASAYUKI;SAIDA SHIGEHIKO;TSUNASHIMA YOSHITAKA
分类号 H01L21/316;H01L21/28;H01L21/318;H01L21/76;H01L21/768;H01L21/8242;H01L23/522;H01L27/108;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/316
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