| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a solid-state image sensing device reducing the warp of a junction board and having high stability and uniformity and the solid-state image sensing device. SOLUTION: A tabular member 15 is joined with the light-transmitting board 14 side of the junction board 10 joining a solid-state image-sensing element wafer 18 and a light-transmitting board 14. Consequently, the solid-state image sensing device 21 reducing the warp of the junction board 10 in a process with a heating and having high stability and uniformity can be provided. COPYRIGHT: (C)2008,JPO&INPIT
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