发明名称 MULTILAYER SUBSTRATE AND ITS PRODUCTION PROCESS
摘要 PROBLEM TO BE SOLVED: To provide a multilayer substrate in which the occurrence of swelling of a conductor layer is suppressed when it receives thermal hysteresis at high temperature in reflow process, while applying a dielectric material containing aromatic liquid crystal polyester and dielectric ceramic particles as an insulation layer. SOLUTION: The multilayer substrate comprises a plurality of insulation layers 5, an inner conductor layer 3 provided between adjoining insulation layers 5, and an outer conductor layer 7 provided on the outermost layer. The insulation layer 5 contains aromatic liquid crystal polyester and dielectric ceramic particles, the inner conductor layer 3 and the outer conductor layer 7 contain at least one of Cu and Ag, and protective layers 31, 32 and 33 containing a metal element having standard free energy of formation of an oxide lower than that of Cu are provided to cover the opposite sides of the inner conductor layer 3 and the insulation layer 5 side of the outer conductor layer 7, respectively. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007273537(A) 申请公布日期 2007.10.18
申请号 JP20060094461 申请日期 2006.03.30
申请人 TDK CORP 发明人 OKAWA HIROSHIGE;KAWABATA KENICHI
分类号 H05K3/46;C08K3/22;C08L67/00;H05K1/09 主分类号 H05K3/46
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