发明名称 SUBSTRATE LAMINATING DEVICE AND SUBSTRATE LAMINATING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent an upper and a lower substrate from shifting in relative position in a surface direction by preventing the upper and lower substrates held on an upper and a lower stage from having a difference in expansion or contraction as a temperature difference is generated between the upper and lower stages when a chamber is evacuated into a vacuum state. SOLUTION: The substrate laminating device 10 which laminates together the upper substrate 1 held on the upper stage 12 and the lower substrate 2 held on the lower stage 13 while the pressure in the chamber 11 having an opening/closing hole 21 for carrying in and out substrates is reduced is characterized in that the pressure in the chamber 11 is reduced while opposed surfaces of the upper stage 12 and lower stage 13 in the chamber 11 are held at an interval D2 smaller than an interval D1 when the upper substrate 1 and lower substrate 2 are supplied onto the upper stage 12 and lower stage 13 respectively. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007271791(A) 申请公布日期 2007.10.18
申请号 JP20060095567 申请日期 2006.03.30
申请人 SHIBAURA MECHATRONICS CORP 发明人 ISHIYAMA HIDEKAZU
分类号 G02F1/13 主分类号 G02F1/13
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