| 摘要 |
PROBLEM TO BE SOLVED: To enable electrically connecting a semiconductor element with electrode pitches of 30 μm or less to a circuit board, and to realize high density mounting of the semiconductor device. SOLUTION: Connecting an interposer 1 with its face downward to the circuit board 7, and the semiconductor element 4 with its face downward to the interposer 1, allows semiconductor element 4 to be connected on a semiconductor wiring spacing level, and connection with the circuit board 7 in a conventional pitch to be performed. Furthermore, using a semiconductor substrate incorporating a functional circuit in the interposer, allows a substrate size to be drastically reduced and greatly contributes to the miniaturization of products. COPYRIGHT: (C)2008,JPO&INPIT |
