| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow furnace which efficiently burns a flux component in an atmosphere gas, and can control the temperature of a heat chamber without using a specific cooling means to reduce heating in the heat chamber. SOLUTION: The reflow furnace includes a transfer means that transfers a circuit board with an electronic component mounted thereon, the heating chamber, in which the circuit board is transferred and is heated via the atmosphere gas to carry out soldering; a means that removes part of the atmosphere gas containing a flux component vaporized during the soldering; a means that heats the removed atmosphere gas to a desired temperature, and an atmosphere cleaning unit having an oxidation catalyst that causes a flux component contained in the heated atmosphere gas to burn; and a means that sends a high-temperature gas resulting from a burning process back to the heating chamber. COPYRIGHT: (C)2008,JPO&INPIT |
