SUBSTRATE-TREATING APPARATUS AND SUBSTRATE TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate-treating device and a substrate treatment method capable of cleaning the peripheral end face of a substrate appropriately regardless of the position of the substrate to a brush. SOLUTION: The substrate-treating device has a press holding mechanism 38 for adjusting the press in the horizontal direction of a brush 15 to the peripheral end face 14 of a wafer W. The cleaning surface 22 of the brush 15 is brought into contact with the peripheral end face 14 of the wafer W rotated by a spin chuck 3, and the peripheral end face 14 of the wafer W is cleaned by the brush 15. The press in the horizontal direction of the brush 15 to the peripheral end face 14 of the wafer W is held at fixed press set on a recipe by the action of the press holding mechanism 38. COPYRIGHT: (C)2008,JPO&INPIT