发明名称 |
PLATING METHOD, ELECTROCONDUCTIVE FILM, PROCESS FOR PRODUCING THE ELECTROCONDUCTIVE FILM, AND OPTICALLY TRANSPARENT ELECTROMAGNETIC WAVE SHIELDING FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for electroplating on a mesh pattern on a film having high surface resistivity evenly without increasing the line width, and an electroconductive film having excellent electroconductivity and an optically transparent electromagnetic wave shielding film having excellent electromagnetic wave shielding effect using the method. SOLUTION: In the method for continuously electroplating an identical type of a noble metal on the surface of a film having a surface resistivity of 1 to 1,000Ω/SQUARE using a continuously provided plurality of electroplating tanks, the accumulated plating electrification amount in the former part from the upstream toward the down stream of the plurality of electroplating tank is not less than 14.40% and less than 50.20% based on the total accumulated plating electrification amount. The electromagnetic wave shielding film and optically transparent electromagnetic wave shielding film use the method. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2007270353(A) |
申请公布日期 |
2007.10.18 |
申请号 |
JP20070059759 |
申请日期 |
2007.03.09 |
申请人 |
FUJIFILM CORP |
发明人 |
MATSUMOTO KEISUKE;NOMURA HIDEAKI |
分类号 |
C25D21/12;C25D5/56;C25D7/06;H05K9/00 |
主分类号 |
C25D21/12 |
代理机构 |
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主权项 |
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地址 |
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